@article{24529a60d4db49a4a9ef5e56410543a8,
title = "Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations",
keywords = "Electromigration, Interfacial reactions, Intermetallic compound (IMC), Lead-free solder, Metallization, Tensile strength",
author = "Aditya Kumar and Ying Yang and Wong, \{Chee C.\} and Vaidhyanathan Kripesh and Zhong Chen",
year = "2009",
month = jan,
doi = "10.1007/s11664-008-0565-6",
language = "English",
volume = "38",
pages = "78--87",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
number = "1",
}