Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder

A. Kumar; M. He; Z. Chen; P. S. Teo

doi:10.1016/j.tsf.2004.05.042

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder

A. Kumar
, M. He
, Z. Chen
, P. S. Teo

Nanyang Technological University
Agency for Science, Technology and Research, Singapore

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	413-418
Number of pages	6
Journal	Thin Solid Films
Volume	462-463
Issue number	SPEC. ISS.
DOIs	https://doi.org/10.1016/j.tsf.2004.05.042
State	Published - Sep 2004
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

Keywords

Electroless Ni-P
Electromigration
Interfacial reactions
Solder

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10.1016/j.tsf.2004.05.042

Cite this

@article{a0419ff2e1d14ad9972aa1e4c0517b6e,

title = "Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5\% Ag solder",

keywords = "Electroless Ni-P, Electromigration, Interfacial reactions, Solder",

author = "A. Kumar and M. He and Z. Chen and Teo, \{P. S.\}",

year = "2004",

month = sep,

doi = "10.1016/j.tsf.2004.05.042",

language = "English",

volume = "462-463",

pages = "413--418",

journal = "Thin Solid Films",

issn = "0040-6090",

number = "SPEC. ISS.",

}

TY - JOUR

T1 - Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder

AU - Kumar, A.

AU - He, M.

AU - Chen, Z.

AU - Teo, P. S.

PY - 2004/9

Y1 - 2004/9

KW - Electroless Ni-P

KW - Electromigration

KW - Interfacial reactions

KW - Solder

UR - https://www.scopus.com/pages/publications/4344593985

UR - https://www.scopus.com/pages/publications/4344593985#tab=citedBy

U2 - 10.1016/j.tsf.2004.05.042

DO - 10.1016/j.tsf.2004.05.042

M3 - Article

AN - SCOPUS:4344593985

SN - 0040-6090

VL - 462-463

SP - 413

EP - 418

JO - Thin Solid Films

JF - Thin Solid Films

IS - SPEC. ISS.

ER -

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder

ASJC Scopus Subject Areas

Keywords

Access to Document

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