Differential Vias Transition Modeling in a Multilayer Printed Circuit Board

Matteo Cocchini; Wheling Cheng; Jianmin Zhang; John Fisher; Jun Fan; James L. Drewniak; Yaojiang Zhang

doi:10.1109/ISEMC.2008.4652164

Differential Vias Transition Modeling in a Multilayer Printed Circuit Board

Matteo Cocchini
, Wheling Cheng
, Jianmin Zhang
, John Fisher
, Jun Fan
, James L. Drewniak
, Yaojiang Zhang

Electrical and Computer Engineering

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.

Original language	American English
Article number	4652164
Journal	Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI)
Volume	2008-January
DOIs	https://doi.org/10.1109/ISEMC.2008.4652164
State	Published - Aug 1 2008
Event	2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 - Detroit, MI, Germany Duration: Aug 18 2008 → Aug 22 2008

Keywords

Cavity Model
Differential Signal
Ground Vias
Noise Coupling
Signal Via Transition
Via Capacitance
Integrated Circuit Modeling
Frequency Measurement
Capacitance
Geometry
Transmission Line Measurements
Dielectric Measurements
Stripline
SPICE
Microstrip Circuits
Printed Circuit Testing
S-Parameters

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/ISEMC.2008.4652164License: CC BY

Differential Vias Transition Modeling in a Multilayer Printed CirFinal published version, 584 KBLicense: CC BY

Cite this

@article{93de20e9024c4a189d9714bbb6c9ded5,

title = "Differential Vias Transition Modeling in a Multilayer Printed Circuit Board",

abstract = " A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.",

keywords = "Cavity Model, Differential Signal, Ground Vias, Noise Coupling, Signal Via Transition, Via Capacitance, Integrated Circuit Modeling, Frequency Measurement, Capacitance, Geometry, Transmission Line Measurements, Dielectric Measurements, Stripline, SPICE, Microstrip Circuits, Printed Circuit Testing, S-Parameters",

author = "Matteo Cocchini and Wheling Cheng and Jianmin Zhang and John Fisher and Jun Fan and Drewniak, \{James L.\} and Yaojiang Zhang",

note = "Publisher Copyright: {\textcopyright} 2008 IEEE.; 2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 ; Conference date: 18-08-2008 Through 22-08-2008",

year = "2008",

month = aug,

day = "1",

doi = "10.1109/ISEMC.2008.4652164",

language = "American English",

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TY - JOUR

T1 - Differential Vias Transition Modeling in a Multilayer Printed Circuit Board

AU - Cocchini, Matteo

AU - Cheng, Wheling

AU - Zhang, Jianmin

AU - Fisher, John

AU - Fan, Jun

AU - Drewniak, James L.

AU - Zhang, Yaojiang

PY - 2008/8/1

Y1 - 2008/8/1

N2 - A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.

AB - A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.

KW - Cavity Model

KW - Differential Signal

KW - Ground Vias

KW - Noise Coupling

KW - Signal Via Transition

KW - Via Capacitance

KW - Integrated Circuit Modeling

KW - Frequency Measurement

KW - Capacitance

KW - Geometry

KW - Transmission Line Measurements

KW - Dielectric Measurements

KW - Stripline

KW - SPICE

KW - Microstrip Circuits

KW - Printed Circuit Testing

KW - S-Parameters

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/748

U2 - 10.1109/ISEMC.2008.4652164

DO - 10.1109/ISEMC.2008.4652164

M3 - Article

VL - 2008-January

JO - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI)

JF - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI)

M1 - 4652164

T2 - 2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008

Y2 - 18 August 2008 through 22 August 2008

ER -

Differential Vias Transition Modeling in a Multilayer Printed Circuit Board

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