Development of fine pitch solder microbumps for 3D chip stacking

Aibin Yu; Aditya Kumar; Soon Wee Ho; Hnin Wai Yin; John H. Lau; Khong Chee Houe; Sharon Lim Pei Siang; Xiaowu Zhang; Da Quan Yu; Nandar Su; Michelle Chew Bi-Rong; Jong Ming Ching; Tan Teck Chun; Vaidyanathan Kripesh; Charles Lee; Jun Pin Huang; James Chiang; Scott Chen; Chi Hsin Chiu; Chang Yueh Chan; Chin Huang Chang; Chih Ming Huang; Cheng Hsu Hsiao

doi:10.1109/EPTC.2008.4763465

Development of fine pitch solder microbumps for 3D chip stacking

Aibin Yu
, Aditya Kumar
, Soon Wee Ho
, Hnin Wai Yin
, John H. Lau
, Khong Chee Houe
, Sharon Lim Pei Siang
, Xiaowu Zhang
, Da Quan Yu
, Nandar Su
, Michelle Chew Bi-Rong
, Jong Ming Ching
, Tan Teck Chun
, Vaidyanathan Kripesh
, Charles Lee
, Jun Pin Huang
, James Chiang
, Scott Chen
, Chi Hsin Chiu
, Chang Yueh Chan

Chin Huang Chang, Chih Ming Huang, Cheng Hsu Hsiao

Agency for Science, Technology and Research, Singapore
Siliconware Precision Industries Co., Ltd.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	10th Electronics Packaging Technology Conference, EPTC 2008
Pages	387-392
Number of pages	6
DOIs	https://doi.org/10.1109/EPTC.2008.4763465
State	Published - 2008
Externally published	Yes
Event	10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore Duration: Dec 9 2008 → Dec 12 2008

Publication series

Name	10th Electronics Packaging Technology Conference, EPTC 2008

Conference

Conference	10th Electronics Packaging Technology Conference, EPTC 2008
Country/Territory	Singapore
City	Singapore
Period	12/9/08 → 12/12/08

ASJC Scopus Subject Areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/EPTC.2008.4763465

Cite this

Yu, A., Kumar, A., Ho, S. W., Yin, H. W., Lau, J. H., Houe, K. C., Siang, S. L. P., Zhang, X., Yu, D. Q., Su, N., Bi-Rong, M. C., Ching, J. M., Chun, T. T., Kripesh, V., Lee, C., Huang, J. P., Chiang, J., Chen, S., Chiu, C. H., ... Hsiao, C. H. (2008). Development of fine pitch solder microbumps for 3D chip stacking. In 10th Electronics Packaging Technology Conference, EPTC 2008 (pp. 387-392). Article 4763465 (10th Electronics Packaging Technology Conference, EPTC 2008). https://doi.org/10.1109/EPTC.2008.4763465

Yu, A, Kumar, A, Ho, SW, Yin, HW, Lau, JH, Houe, KC, Siang, SLP, Zhang, X, Yu, DQ, Su, N, Bi-Rong, MC, Ching, JM, Chun, TT, Kripesh, V, Lee, C, Huang, JP, Chiang, J, Chen, S, Chiu, CH, Chan, CY, Chang, CH, Huang, CM & Hsiao, CH 2008, Development of fine pitch solder microbumps for 3D chip stacking. in 10th Electronics Packaging Technology Conference, EPTC 2008., 4763465, 10th Electronics Packaging Technology Conference, EPTC 2008, pp. 387-392, 10th Electronics Packaging Technology Conference, EPTC 2008, Singapore, Singapore, 12/9/08. https://doi.org/10.1109/EPTC.2008.4763465

@inproceedings{c7622a7e14b344bea16af9d0856062e0,

title = "Development of fine pitch solder microbumps for 3D chip stacking",

author = "Aibin Yu and Aditya Kumar and Ho, \{Soon Wee\} and Yin, \{Hnin Wai\} and Lau, \{John H.\} and Houe, \{Khong Chee\} and Siang, \{Sharon Lim Pei\} and Xiaowu Zhang and Yu, \{Da Quan\} and Nandar Su and Bi-Rong, \{Michelle Chew\} and Ching, \{Jong Ming\} and Chun, \{Tan Teck\} and Vaidyanathan Kripesh and Charles Lee and Huang, \{Jun Pin\} and James Chiang and Scott Chen and Chiu, \{Chi Hsin\} and Chan, \{Chang Yueh\} and Chang, \{Chin Huang\} and Huang, \{Chih Ming\} and Hsiao, \{Cheng Hsu\}",

year = "2008",

doi = "10.1109/EPTC.2008.4763465",

language = "English",

isbn = "9781424421183",

series = "10th Electronics Packaging Technology Conference, EPTC 2008",

pages = "387--392",

booktitle = "10th Electronics Packaging Technology Conference, EPTC 2008",

note = "10th Electronics Packaging Technology Conference, EPTC 2008 ; Conference date: 09-12-2008 Through 12-12-2008",

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T1 - Development of fine pitch solder microbumps for 3D chip stacking

AU - Yu, Aibin

AU - Kumar, Aditya

AU - Ho, Soon Wee

AU - Yin, Hnin Wai

AU - Lau, John H.

AU - Houe, Khong Chee

AU - Siang, Sharon Lim Pei

AU - Zhang, Xiaowu

AU - Yu, Da Quan

AU - Su, Nandar

AU - Bi-Rong, Michelle Chew

AU - Ching, Jong Ming

AU - Chun, Tan Teck

AU - Kripesh, Vaidyanathan

AU - Lee, Charles

AU - Huang, Jun Pin

AU - Chiang, James

AU - Chen, Scott

AU - Chiu, Chi Hsin

AU - Chan, Chang Yueh

AU - Chang, Chin Huang

AU - Huang, Chih Ming

AU - Hsiao, Cheng Hsu

PY - 2008

Y1 - 2008

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UR - https://www.scopus.com/pages/publications/63049114343#tab=citedBy

U2 - 10.1109/EPTC.2008.4763465

DO - 10.1109/EPTC.2008.4763465

M3 - Conference contribution

AN - SCOPUS:63049114343

SN - 9781424421183

T3 - 10th Electronics Packaging Technology Conference, EPTC 2008

SP - 387

EP - 392

BT - 10th Electronics Packaging Technology Conference, EPTC 2008

T2 - 10th Electronics Packaging Technology Conference, EPTC 2008

Y2 - 9 December 2008 through 12 December 2008

ER -

Development of fine pitch solder microbumps for 3D chip stacking

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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