Development of a Closed-Form Expression for the Input Impedance of Power-ground Plane Structures

Minjia Xu; Yun Ji; Todd H. Hubing; Thomas Van Doren; James L. Drewniak

doi:10.1109/ISEMC.2000.875541

Development of a Closed-Form Expression for the Input Impedance of Power-ground Plane Structures

Minjia Xu
, Yun Ji
, Todd H. Hubing
, Thomas Van Doren
, James L. Drewniak

Electrical and Computer Engineering

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series L _e C circuit below the first board resonance frequency. C is the interplane capacitance and L _e is an effective inductance contributed by all the cavity nodes. The effects of the layer thickness, port location, board size and the feeding wire radius on the value of L _e are discussed in this study. L _e can be estimated from the geometry parameters of the test board. The goal is to obtain a simple model that can be used to analyze the power bus impedance below the first board resonance.

Original language	American English
Pages (from-to)	77-82
Number of pages	6
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	1
DOIs	https://doi.org/10.1109/ISEMC.2000.875541
State	Published - Aug 1 2000
Event	2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA Duration: Aug 21 2000 → Aug 25 2000

ASJC Scopus Subject Areas

Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

EMC
EMI
PCB Design
PCB Power Bus Structures
Board Size
Cavity Modes
Circuit Resonance
Closed-Form Expression
Earthing
Effective Inductance
Electric Impedance
Electromagnetic Compatibility
Electromagnetic Interference
Experiments
Feeding Wire Radius
First Board Resonance Frequency
Full-Wave Numerical Modeling
Geometry Parameters
Input Impedance
Interplane Capacitance
Layer Thickness
Modal Expansion Method
Passive Networks
Port Location
Power Bus Impedance
Power Electronics
Power-Ground Plane Structures
Printed Circuit Design
Series LC Circuit
Test Board
Wires (Electric)

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/ISEMC.2000.875541License: CC BY

Development of a Closed-Form Expression for the Input Impedance oFinal published version, 603 KBLicense: CC BY

Cite this

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title = "Development of a Closed-Form Expression for the Input Impedance of Power-ground Plane Structures",

abstract = " This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series L e C circuit below the first board resonance frequency. C is the interplane capacitance and L e is an effective inductance contributed by all the cavity nodes. The effects of the layer thickness, port location, board size and the feeding wire radius on the value of L e are discussed in this study. L e can be estimated from the geometry parameters of the test board. The goal is to obtain a simple model that can be used to analyze the power bus impedance below the first board resonance.",

keywords = "EMC, EMI, PCB Design, PCB Power Bus Structures, Board Size, Cavity Modes, Circuit Resonance, Closed-Form Expression, Earthing, Effective Inductance, Electric Impedance, Electromagnetic Compatibility, Electromagnetic Interference, Experiments, Feeding Wire Radius, First Board Resonance Frequency, Full-Wave Numerical Modeling, Geometry Parameters, Input Impedance, Interplane Capacitance, Layer Thickness, Modal Expansion Method, Passive Networks, Port Location, Power Bus Impedance, Power Electronics, Power-Ground Plane Structures, Printed Circuit Design, Series LC Circuit, Test Board, Wires (Electric)",

author = "Minjia Xu and Yun Ji and Hubing, \{Todd H.\} and \{Van Doren\}, Thomas and Drewniak, \{James L.\}",

year = "2000",

month = aug,

day = "1",

doi = "10.1109/ISEMC.2000.875541",

language = "American English",

volume = "1",

pages = "77--82",

journal = "IEEE International Symposium on Electromagnetic Compatibility",

issn = "0190-1494",

note = "2000 IEEE International Symposium on Electromagneti Compatibility ; Conference date: 21-08-2000 Through 25-08-2000",

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TY - JOUR

T1 - Development of a Closed-Form Expression for the Input Impedance of Power-ground Plane Structures

AU - Xu, Minjia

AU - Ji, Yun

AU - Hubing, Todd H.

AU - Van Doren, Thomas

AU - Drewniak, James L.

PY - 2000/8/1

Y1 - 2000/8/1

N2 - This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series L e C circuit below the first board resonance frequency. C is the interplane capacitance and L e is an effective inductance contributed by all the cavity nodes. The effects of the layer thickness, port location, board size and the feeding wire radius on the value of L e are discussed in this study. L e can be estimated from the geometry parameters of the test board. The goal is to obtain a simple model that can be used to analyze the power bus impedance below the first board resonance.

AB - This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series L e C circuit below the first board resonance frequency. C is the interplane capacitance and L e is an effective inductance contributed by all the cavity nodes. The effects of the layer thickness, port location, board size and the feeding wire radius on the value of L e are discussed in this study. L e can be estimated from the geometry parameters of the test board. The goal is to obtain a simple model that can be used to analyze the power bus impedance below the first board resonance.

KW - EMC

KW - EMI

KW - PCB Design

KW - PCB Power Bus Structures

KW - Board Size

KW - Cavity Modes

KW - Circuit Resonance

KW - Closed-Form Expression

KW - Earthing

KW - Effective Inductance

KW - Electric Impedance

KW - Electromagnetic Compatibility

KW - Electromagnetic Interference

KW - Experiments

KW - Feeding Wire Radius

KW - First Board Resonance Frequency

KW - Full-Wave Numerical Modeling

KW - Geometry Parameters

KW - Input Impedance

KW - Interplane Capacitance

KW - Layer Thickness

KW - Modal Expansion Method

KW - Passive Networks

KW - Port Location

KW - Power Bus Impedance

KW - Power Electronics

KW - Power-Ground Plane Structures

KW - Printed Circuit Design

KW - Series LC Circuit

KW - Test Board

KW - Wires (Electric)

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UR - https://www.scopus.com/pages/publications/0033681359#tab=citedBy

U2 - 10.1109/ISEMC.2000.875541

DO - 10.1109/ISEMC.2000.875541

M3 - Article

SN - 0190-1494

VL - 1

SP - 77

EP - 82

JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

T2 - 2000 IEEE International Symposium on Electromagneti Compatibility

Y2 - 21 August 2000 through 25 August 2000

ER -

Development of a Closed-Form Expression for the Input Impedance of Power-ground Plane Structures

Abstract

ASJC Scopus Subject Areas

Keywords

Disciplines

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