Development of 25-μm-pitch microbumps for 3-D chip stacking

Aibin Yu; Aditya Kumar; Soon Wee Ho; Hnin Wai Yin; John H. Lau; Nandar Su; Khong Chee Houe; Jong Ming Ching; Vaidyanathan Kripesh; Scott Chen; Chien Feng Chan; Chun Chieh Chao; Chi Hsin Chiu; Chang Yueh Chan; Chin Huang Chang; Chih Ming Huang; Carl Chen

doi:10.1109/TCPMT.2012.2203130

Development of 25-μm-pitch microbumps for 3-D chip stacking

Aibin Yu
, Aditya Kumar
, Soon Wee Ho
, Hnin Wai Yin
, John H. Lau
, Nandar Su
, Khong Chee Houe
, Jong Ming Ching
, Vaidyanathan Kripesh
, Scott Chen
, Chien Feng Chan
, Chun Chieh Chao
, Chi Hsin Chiu
, Chang Yueh Chan
, Chin Huang Chang
, Chih Ming Huang
, Carl Chen

Agency for Science, Technology and Research, Singapore
Micron Technology Incorporated
Global Foundries, Inc.
Industrial Technology Research Institute of Taiwan
Siliconware Precision Industries Co., Ltd.

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	6305526
Pages (from-to)	1777-1785
Number of pages	9
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	2
Issue number	11
DOIs	https://doi.org/10.1109/TCPMT.2012.2203130
State	Published - 2012
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Keywords

Cu pillar
electroless nickel/immersion gold (ENIG)
interconnects
microbump
stacking

Access to Document

10.1109/TCPMT.2012.2203130

Cite this

Yu, A., Kumar, A., Ho, S. W., Yin, H. W., Lau, J. H., Su, N., Houe, K. C., Ching, J. M., Kripesh, V., Chen, S., Chan, C. F., Chao, C. C., Chiu, C. H., Chan, C. Y., Chang, C. H., Huang, C. M., & Chen, C. (2012). Development of 25-μm-pitch microbumps for 3-D chip stacking. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(11), 1777-1785. Article 6305526. https://doi.org/10.1109/TCPMT.2012.2203130

Yu, A, Kumar, A, Ho, SW, Yin, HW, Lau, JH, Su, N, Houe, KC, Ching, JM, Kripesh, V, Chen, S, Chan, CF, Chao, CC, Chiu, CH, Chan, CY, Chang, CH, Huang, CM & Chen, C 2012, 'Development of 25-μm-pitch microbumps for 3-D chip stacking', IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 11, 6305526, pp. 1777-1785. https://doi.org/10.1109/TCPMT.2012.2203130

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title = "Development of 25-μm-pitch microbumps for 3-D chip stacking",

keywords = "Cu pillar, electroless nickel/immersion gold (ENIG), interconnects, microbump, stacking",

author = "Aibin Yu and Aditya Kumar and Ho, \{Soon Wee\} and Yin, \{Hnin Wai\} and Lau, \{John H.\} and Nandar Su and Houe, \{Khong Chee\} and Ching, \{Jong Ming\} and Vaidyanathan Kripesh and Scott Chen and Chan, \{Chien Feng\} and Chao, \{Chun Chieh\} and Chiu, \{Chi Hsin\} and Chan, \{Chang Yueh\} and Chang, \{Chin Huang\} and Huang, \{Chih Ming\} and Carl Chen",

year = "2012",

doi = "10.1109/TCPMT.2012.2203130",

language = "English",

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AU - Yu, Aibin

AU - Kumar, Aditya

AU - Ho, Soon Wee

AU - Yin, Hnin Wai

AU - Lau, John H.

AU - Su, Nandar

AU - Houe, Khong Chee

AU - Ching, Jong Ming

AU - Kripesh, Vaidyanathan

AU - Chen, Scott

AU - Chan, Chien Feng

AU - Chao, Chun Chieh

AU - Chiu, Chi Hsin

AU - Chan, Chang Yueh

AU - Chang, Chin Huang

AU - Huang, Chih Ming

AU - Chen, Carl

PY - 2012

Y1 - 2012

KW - Cu pillar

KW - electroless nickel/immersion gold (ENIG)

KW - interconnects

KW - microbump

KW - stacking

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UR - https://www.scopus.com/pages/publications/84869499735#tab=citedBy

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

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ER -

Development of 25-μm-pitch microbumps for 3-D chip stacking

ASJC Scopus Subject Areas

Keywords

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