Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects

Sathvika Bandi; Reza Asadi; Zhekun Peng; Srinivas Venkataraman; Granthana Rangaswamy; Santosh Pappu; Xu Wang; Dong Hyun Kim

doi:10.1109/EMCSIPI52291.2025.11169776

Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects

Sathvika Bandi
, Reza Asadi
, Zhekun Peng
, Srinivas Venkataraman
, Granthana Rangaswamy
, Santosh Pappu
, Xu Wang
, Dong Hyun Kim

Electrical and Computer Engineering

Missouri University of Science and Technology
Meta

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	244-249
Number of pages	6
ISBN (Electronic)	9798331508746
DOIs	https://doi.org/10.1109/EMCSIPI52291.2025.11169776
State	Published - 2025
Event	2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025 - Raleigh, United States Duration: Aug 18 2025 → Aug 22 2025

Publication series

Name	IEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)	1077-4076
ISSN (Electronic)	2158-1118

Conference

Conference	2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025
Country/Territory	United States
City	Raleigh
Period	8/18/25 → 8/22/25

ASJC Scopus Subject Areas

Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

Common mode S-parameters
Insertion Loss
PCB
Return Loss
Strip-line (SL)
TDR
Via

Access to Document

10.1109/EMCSIPI52291.2025.11169776

Cite this

Bandi, S., Asadi, R., Peng, Z., Venkataraman, S., Rangaswamy, G., Pappu, S., Wang, X., & Kim, D. H. (2025). Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects. In 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025 (pp. 244-249). (IEEE International Symposium on Electromagnetic Compatibility). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMCSIPI52291.2025.11169776

Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects. / Bandi, Sathvika; Asadi, Reza; Peng, Zhekun et al.
2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025. Institute of Electrical and Electronics Engineers Inc., 2025. p. 244-249 (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Bandi, S, Asadi, R, Peng, Z, Venkataraman, S, Rangaswamy, G, Pappu, S, Wang, X & Kim, DH 2025, Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects. in 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025. IEEE International Symposium on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers Inc., pp. 244-249, 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025, Raleigh, United States, 8/18/25. https://doi.org/10.1109/EMCSIPI52291.2025.11169776

Bandi S, Asadi R, Peng Z, Venkataraman S, Rangaswamy G, Pappu S et al. Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects. In 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025. Institute of Electrical and Electronics Engineers Inc. 2025. p. 244-249. (IEEE International Symposium on Electromagnetic Compatibility). doi: 10.1109/EMCSIPI52291.2025.11169776

Bandi, Sathvika ; Asadi, Reza ; Peng, Zhekun et al. / Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects. 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025. Institute of Electrical and Electronics Engineers Inc., 2025. pp. 244-249 (IEEE International Symposium on Electromagnetic Compatibility).

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title = "Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects",

keywords = "Common mode S-parameters, Insertion Loss, PCB, Return Loss, Strip-line (SL), TDR, Via",

author = "Sathvika Bandi and Reza Asadi and Zhekun Peng and Srinivas Venkataraman and Granthana Rangaswamy and Santosh Pappu and Xu Wang and Kim, \{Dong Hyun\}",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC + SIPI 2025 ; Conference date: 18-08-2025 Through 22-08-2025",

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KW - Return Loss

KW - Strip-line (SL)

KW - TDR

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M3 - Conference contribution

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Design Strategies for Skew Compensation in Highspeed PCB Strip Line Interconnects

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ASJC Scopus Subject Areas

Keywords

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