Design of the TM010 mode cylindrical cavity resonator for PCB dielectric characterization

Reza Asadi; Chaofeng Li; Seyedmehdi Mousavi; Seyed Moastafa Mousavi; Reza Vahdani; Xiaoning Ye; Dong Hyun Kim

doi:10.1109/EMCSIPI49824.2024.10705488

Design of the TM₀₁₀ mode cylindrical cavity resonator for PCB dielectric characterization

Reza Asadi
, Chaofeng Li
, Seyedmehdi Mousavi
, Seyed Moastafa Mousavi
, Reza Vahdani
, Xiaoning Ye
, Dong Hyun Kim

Electrical and Computer Engineering

Missouri University of Science and Technology
Intel

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	125-129
Number of pages	5
ISBN (Electronic)	9798350360394
DOIs	https://doi.org/10.1109/EMCSIPI49824.2024.10705488
State	Published - 2024
Event	2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024 - Phoenix, United States Duration: Aug 5 2024 → Aug 9 2024

Publication series

Name	IEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)	1077-4076
ISSN (Electronic)	2158-1118

Conference

Conference	2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024
Country/Territory	United States
City	Phoenix
Period	8/5/24 → 8/9/24

ASJC Scopus Subject Areas

Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

cavity feeding
cavity resonator
Df
Dk
Electric probe
Magnetic probe
PCB material characterization
TM mode

Access to Document

10.1109/EMCSIPI49824.2024.10705488

Cite this

Asadi, R., Li, C., Mousavi, S., Mousavi, S. M., Vahdani, R., Ye, X., & Kim, D. H. (2024). Design of the TM₀₁₀ mode cylindrical cavity resonator for PCB dielectric characterization. In 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024 (pp. 125-129). (IEEE International Symposium on Electromagnetic Compatibility). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMCSIPI49824.2024.10705488

Design of the TM₀₁₀ mode cylindrical cavity resonator for PCB dielectric characterization. / Asadi, Reza; Li, Chaofeng; Mousavi, Seyedmehdi et al.
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc., 2024. p. 125-129 (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Asadi, R, Li, C, Mousavi, S, Mousavi, SM, Vahdani, R, Ye, X & Kim, DH 2024, Design of the TM₀₁₀ mode cylindrical cavity resonator for PCB dielectric characterization. in 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. IEEE International Symposium on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers Inc., pp. 125-129, 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024, Phoenix, United States, 8/5/24. https://doi.org/10.1109/EMCSIPI49824.2024.10705488

Asadi R, Li C, Mousavi S, Mousavi SM, Vahdani R, Ye X et al. Design of the TM₀₁₀ mode cylindrical cavity resonator for PCB dielectric characterization. In 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc. 2024. p. 125-129. (IEEE International Symposium on Electromagnetic Compatibility). doi: 10.1109/EMCSIPI49824.2024.10705488

Asadi, Reza ; Li, Chaofeng ; Mousavi, Seyedmehdi et al. / Design of the TM₀₁₀ mode cylindrical cavity resonator for PCB dielectric characterization. 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc., 2024. pp. 125-129 (IEEE International Symposium on Electromagnetic Compatibility).

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