Design method of low Passive Intermodulation Test Chamber with EPP Absorber

Zhanghua Cai; Yantao Zhou; Lie Liu; Yihong Qi

doi:10.1109/ISEMC.2019.8825263

Design method of low Passive Intermodulation Test Chamber with EPP Absorber

Zhanghua Cai
, Yantao Zhou
, Lie Liu
, Yihong Qi

Hunan University
General Test Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	421
Number of pages	1
ISBN (Electronic)	9781538691991
DOIs	https://doi.org/10.1109/ISEMC.2019.8825263
State	Published - Jul 2019
Externally published	Yes
Event	2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 - New Orleans, United States Duration: Jul 22 2019 → Jul 26 2019

Publication series

Name	2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

Conference

Conference	2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
Country/Territory	United States
City	New Orleans
Period	7/22/19 → 7/26/19

ASJC Scopus Subject Areas

Signal Processing
Energy Engineering and Power Technology
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality

Access to Document

10.1109/ISEMC.2019.8825263

Cite this

Cai, Z., Zhou, Y., Liu, L., & Qi, Y. (2019). Design method of low Passive Intermodulation Test Chamber with EPP Absorber. In 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (pp. 421). Article 8825263 (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISEMC.2019.8825263

Design method of low Passive Intermodulation Test Chamber with EPP Absorber. / Cai, Zhanghua; Zhou, Yantao; Liu, Lie et al.
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 421 8825263 (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Cai, Z, Zhou, Y, Liu, L & Qi, Y 2019, Design method of low Passive Intermodulation Test Chamber with EPP Absorber. in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019., 8825263, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, Institute of Electrical and Electronics Engineers Inc., pp. 421, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, New Orleans, United States, 7/22/19. https://doi.org/10.1109/ISEMC.2019.8825263

Cai Z, Zhou Y, Liu L, Qi Y. Design method of low Passive Intermodulation Test Chamber with EPP Absorber. In 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 421. 8825263. (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019). doi: 10.1109/ISEMC.2019.8825263

Cai, Zhanghua ; Zhou, Yantao ; Liu, Lie et al. / Design method of low Passive Intermodulation Test Chamber with EPP Absorber. 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 421 (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019).

@inproceedings{af9686f47dfb48c4a865b13f9d4f9983,

title = "Design method of low Passive Intermodulation Test Chamber with EPP Absorber",

author = "Zhanghua Cai and Yantao Zhou and Lie Liu and Yihong Qi",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 ; Conference date: 22-07-2019 Through 26-07-2019",

year = "2019",

month = jul,

doi = "10.1109/ISEMC.2019.8825263",

language = "English",

series = "2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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}

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AU - Liu, Lie

AU - Qi, Yihong

PY - 2019/7

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M3 - Conference contribution

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BT - 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

Y2 - 22 July 2019 through 26 July 2019

ER -

Design method of low Passive Intermodulation Test Chamber with EPP Absorber

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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