Abstract
In this paper, the de-embedding study presented in [1] is extended from the simulation environment to the measurement environment; the three presented de-embedding methods are applied to measurements of on-chip coplanar traces for two different test ICs. Additionally, the Hybrid technique presented in [1] is reformulated so that only two measurement standards are required, as opposed to three. The results of de-embedding the measurement data are discussed, as well as challenges with making the measurements.
| Original language | American English |
|---|---|
| Journal | Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC) |
| DOIs | |
| State | Published - Aug 8 2014 |
Keywords
- De-embedding
- De-embedding method
- De-embedding techniques
- Electromagnetic compatibility
- Hybrid techniques
- Measurement data
- Measurement standards
- Measurements of
- Simulation environment
Disciplines
- Electrical and Computer Engineering
- Numerical Analysis and Scientific Computing
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