Data pattern based electromagnetic interference modeling for IC packaging

Nick K.H. Huang; Tao Wang; Li Jun Jiang; X. Y. Xiong

doi:10.1109/EPEPS.2014.7103640

Data pattern based electromagnetic interference modeling for IC packaging

Nick K.H. Huang
, Tao Wang
, Li Jun Jiang
, X. Y. Xiong

The University of Hong Kong
Teradyne Inc., USA

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	227-230
Number of pages	4
ISBN (Electronic)	9781479936410
DOIs	https://doi.org/10.1109/EPEPS.2014.7103640
State	Published - 2014
Externally published	Yes
Event	23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 - Portland, United States Duration: Oct 26 2014 → Oct 29 2014

Publication series

Name	2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014

Conference

Conference	23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
Country/Territory	United States
City	Portland
Period	10/26/14 → 10/29/14

ASJC Scopus Subject Areas

Hardware and Architecture
Electrical and Electronic Engineering

Keywords

cavity mode
EM radiated emission
EMI
IC packaging
linear superposition
via trace radiation

Access to Document

10.1109/EPEPS.2014.7103640

Cite this

Huang, N. K. H., Wang, T., Jiang, L. J., & Xiong, X. Y. (2014). Data pattern based electromagnetic interference modeling for IC packaging. In 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 (pp. 227-230). Article 7103640 (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2014.7103640

Data pattern based electromagnetic interference modeling for IC packaging. / Huang, Nick K.H.; Wang, Tao; Jiang, Li Jun et al.
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 227-230 7103640 (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Huang, NKH, Wang, T, Jiang, LJ & Xiong, XY 2014, Data pattern based electromagnetic interference modeling for IC packaging. in 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014., 7103640, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014, Institute of Electrical and Electronics Engineers Inc., pp. 227-230, 23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014, Portland, United States, 10/26/14. https://doi.org/10.1109/EPEPS.2014.7103640

Huang NKH, Wang T, Jiang LJ, Xiong XY. Data pattern based electromagnetic interference modeling for IC packaging. In 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 227-230. 7103640. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014). doi: 10.1109/EPEPS.2014.7103640

Huang, Nick K.H. ; Wang, Tao ; Jiang, Li Jun et al. / Data pattern based electromagnetic interference modeling for IC packaging. 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 227-230 (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

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title = "Data pattern based electromagnetic interference modeling for IC packaging",

keywords = "cavity mode, EM radiated emission, EMI, IC packaging, linear superposition, via trace radiation",

author = "Huang, \{Nick K.H.\} and Tao Wang and Jiang, \{Li Jun\} and Xiong, \{X. Y.\}",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 ; Conference date: 26-10-2014 Through 29-10-2014",

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doi = "10.1109/EPEPS.2014.7103640",

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AU - Wang, Tao

AU - Jiang, Li Jun

AU - Xiong, X. Y.

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KW - cavity mode

KW - EM radiated emission

KW - EMI

KW - IC packaging

KW - linear superposition

KW - via trace radiation

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BT - 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014

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ER -

Data pattern based electromagnetic interference modeling for IC packaging

Publication series

Conference

ASJC Scopus Subject Areas

Keywords

Access to Document

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Cite this