Cure kinetics and rheology characterization of soy-based epoxy resin system

Guanghui Liang; K. Chandrashekhara

doi:10.1002/app.24369

Cure kinetics and rheology characterization of soy-based epoxy resin system

Guanghui Liang
, K. Chandrashekhara

Mechanical and Aerospace Engineering

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	3168-3180
Number of pages	13
Journal	Journal of Applied Polymer Science
Volume	102
Issue number	4
DOIs	https://doi.org/10.1002/app.24369
State	Published - Nov 15 2006

ASJC Scopus Subject Areas

General Chemistry
Surfaces, Coatings and Films
Polymers and Plastics
Materials Chemistry

Keywords

Cure kinetics
Neural network
Rheology
Soy-based resin

Access to Document

10.1002/app.24369

Cite this

@article{c6592ef7d6ab440eb1393aa4dc908181,

title = "Cure kinetics and rheology characterization of soy-based epoxy resin system",

keywords = "Cure kinetics, Neural network, Rheology, Soy-based resin",

author = "Guanghui Liang and K. Chandrashekhara",

year = "2006",

month = nov,

day = "15",

doi = "10.1002/app.24369",

language = "English",

volume = "102",

pages = "3168--3180",

journal = "Journal of Applied Polymer Science",

issn = "0021-8995",

number = "4",

}

TY - JOUR

T1 - Cure kinetics and rheology characterization of soy-based epoxy resin system

AU - Liang, Guanghui

AU - Chandrashekhara, K.

PY - 2006/11/15

Y1 - 2006/11/15

KW - Cure kinetics

KW - Neural network

KW - Rheology

KW - Soy-based resin

UR - https://www.scopus.com/pages/publications/33750320387

UR - https://www.scopus.com/pages/publications/33750320387#tab=citedBy

U2 - 10.1002/app.24369

DO - 10.1002/app.24369

M3 - Article

SN - 0021-8995

VL - 102

SP - 3168

EP - 3180

JO - Journal of Applied Polymer Science

JF - Journal of Applied Polymer Science

IS - 4

ER -

Cure kinetics and rheology characterization of soy-based epoxy resin system

ASJC Scopus Subject Areas

Keywords

Access to Document

Other files and links

Fingerprint

Cite this