Connectivity-Based Multichip Module Repair

Minsu Choi; Nohpill Park; Fred J. Meyer; Fabrizio Lombardi

doi:10.1109/PRDC.2001.992675

Connectivity-Based Multichip Module Repair

Minsu Choi
, Nohpill Park
, Fred J. Meyer
, Fabrizio Lombardi

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

This paper presents a new model for analyzing the yield of MCM systems with repair process. It exploits the connectivity of the interconnected chips in which yield degradation due to both neighboring chips and interconnect structure are taken into account. Based on the connectivity, two MCM repair scheduling strategies, Smallest Number of Interconnections First (SNIF) and Smallest Number of Neighboring Chips First (SNCF) are proposed. Two other scheduling strategies, Largest Number of Interconnections First (LNIF) and Largest Number of Neighboring Chips First (LNCF) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall yield of MCMs. Extensive parametric simulations demonstrate the efficiency of the proposed MCM repair scheduling strategies.

Original language	American English
Journal	Proceedings of the Pacific Rim International Symposium on Dependable Computing (2001, Seoul, South Korea)
DOIs	https://doi.org/10.1109/PRDC.2001.992675
State	Published - Dec 1 2001

Keywords

Assembly
Degradation
Delay Systems
Fabrication
Integrated Circuit Interconnections
Integrated Circuit Interconnects
Interconnect Structures
Maintenance Engineering
Multichip Modules
Packaging
Parametric Simulations
Printed Circuit Manufacture
Repair
Repair Process
Scheduling
Scheduling Strategies
System Performance
Testing
Yield Degradation

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/PRDC.2001.992675License: Unspecified

https://doi.org/10.1109/PRDC.2001.992675

Cite this

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title = "Connectivity-Based Multichip Module Repair",

abstract = " This paper presents a new model for analyzing the yield of MCM systems with repair process. It exploits the connectivity of the interconnected chips in which yield degradation due to both neighboring chips and interconnect structure are taken into account. Based on the connectivity, two MCM repair scheduling strategies, Smallest Number of Interconnections First (SNIF) and Smallest Number of Neighboring Chips First (SNCF) are proposed. Two other scheduling strategies, Largest Number of Interconnections First (LNIF) and Largest Number of Neighboring Chips First (LNCF) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall yield of MCMs. Extensive parametric simulations demonstrate the efficiency of the proposed MCM repair scheduling strategies.",

keywords = "Assembly, Degradation, Delay Systems, Fabrication, Integrated Circuit Interconnections, Integrated Circuit Interconnects, Interconnect Structures, Maintenance Engineering, Multichip Modules, Packaging, Parametric Simulations, Printed Circuit Manufacture, Repair, Repair Process, Scheduling, Scheduling Strategies, System Performance, Testing, Yield Degradation",

author = "Minsu Choi and Nohpill Park and Meyer, \{Fred J.\} and Fabrizio Lombardi",

year = "2001",

month = dec,

day = "1",

doi = "10.1109/PRDC.2001.992675",

language = "American English",

journal = "Proceedings of the Pacific Rim International Symposium on Dependable Computing (2001, Seoul, South Korea)",

}

TY - JOUR

T1 - Connectivity-Based Multichip Module Repair

AU - Choi, Minsu

AU - Park, Nohpill

AU - Meyer, Fred J.

AU - Lombardi, Fabrizio

PY - 2001/12/1

Y1 - 2001/12/1

N2 - This paper presents a new model for analyzing the yield of MCM systems with repair process. It exploits the connectivity of the interconnected chips in which yield degradation due to both neighboring chips and interconnect structure are taken into account. Based on the connectivity, two MCM repair scheduling strategies, Smallest Number of Interconnections First (SNIF) and Smallest Number of Neighboring Chips First (SNCF) are proposed. Two other scheduling strategies, Largest Number of Interconnections First (LNIF) and Largest Number of Neighboring Chips First (LNCF) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall yield of MCMs. Extensive parametric simulations demonstrate the efficiency of the proposed MCM repair scheduling strategies.

AB - This paper presents a new model for analyzing the yield of MCM systems with repair process. It exploits the connectivity of the interconnected chips in which yield degradation due to both neighboring chips and interconnect structure are taken into account. Based on the connectivity, two MCM repair scheduling strategies, Smallest Number of Interconnections First (SNIF) and Smallest Number of Neighboring Chips First (SNCF) are proposed. Two other scheduling strategies, Largest Number of Interconnections First (LNIF) and Largest Number of Neighboring Chips First (LNCF) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall yield of MCMs. Extensive parametric simulations demonstrate the efficiency of the proposed MCM repair scheduling strategies.

KW - Assembly

KW - Degradation

KW - Delay Systems

KW - Fabrication

KW - Integrated Circuit Interconnections

KW - Integrated Circuit Interconnects

KW - Interconnect Structures

KW - Maintenance Engineering

KW - Multichip Modules

KW - Packaging

KW - Parametric Simulations

KW - Printed Circuit Manufacture

KW - Repair

KW - Repair Process

KW - Scheduling

KW - Scheduling Strategies

KW - System Performance

KW - Testing

KW - Yield Degradation

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/3154

UR - https://doi.org/10.1109/PRDC.2001.992675

U2 - 10.1109/PRDC.2001.992675

DO - 10.1109/PRDC.2001.992675

M3 - Article

JO - Proceedings of the Pacific Rim International Symposium on Dependable Computing (2001, Seoul, South Korea)

JF - Proceedings of the Pacific Rim International Symposium on Dependable Computing (2001, Seoul, South Korea)

ER -

Connectivity-Based Multichip Module Repair

Abstract

Keywords

Disciplines

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