Compressed sensing based analytical modeling for Through-Silicon-Via pairs

Tao Wang; Jingook Kim; Jun Fan; Yiyu Shi

doi:10.1109/MWSCAS.2011.6026430

Compressed sensing based analytical modeling for Through-Silicon-Via pairs

Tao Wang
, Jingook Kim
, Jun Fan
, Yiyu Shi

Electrical and Computer Engineering

Missouri University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
DOIs	https://doi.org/10.1109/MWSCAS.2011.6026430
State	Published - 2011
Event	54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011 - Seoul, Korea, Republic of Duration: Aug 7 2011 → Aug 10 2011

Publication series

Name	Midwest Symposium on Circuits and Systems
ISSN (Print)	1548-3746

Conference

Conference	54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
Country/Territory	Korea, Republic of
City	Seoul
Period	8/7/11 → 8/10/11

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/MWSCAS.2011.6026430

Cite this

Wang, T, Kim, J, Fan, J & Shi, Y 2011, Compressed sensing based analytical modeling for Through-Silicon-Via pairs. in 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011., 6026430, Midwest Symposium on Circuits and Systems, 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011, Seoul, Korea, Republic of, 8/7/11. https://doi.org/10.1109/MWSCAS.2011.6026430

@inproceedings{f375dcc9d2d24bfc8790f4a5974e5cad,

title = "Compressed sensing based analytical modeling for Through-Silicon-Via pairs",

author = "Tao Wang and Jingook Kim and Jun Fan and Yiyu Shi",

year = "2011",

doi = "10.1109/MWSCAS.2011.6026430",

language = "English",

isbn = "9781612848570",

series = "Midwest Symposium on Circuits and Systems",

booktitle = "54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011",

note = "54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011 ; Conference date: 07-08-2011 Through 10-08-2011",

}

TY - GEN

T1 - Compressed sensing based analytical modeling for Through-Silicon-Via pairs

AU - Wang, Tao

AU - Kim, Jingook

AU - Fan, Jun

AU - Shi, Yiyu

PY - 2011

Y1 - 2011

UR - https://www.scopus.com/pages/publications/80053647682

UR - https://www.scopus.com/pages/publications/80053647682#tab=citedBy

U2 - 10.1109/MWSCAS.2011.6026430

DO - 10.1109/MWSCAS.2011.6026430

M3 - Conference contribution

AN - SCOPUS:80053647682

SN - 9781612848570

T3 - Midwest Symposium on Circuits and Systems

BT - 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011

T2 - 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011

Y2 - 7 August 2011 through 10 August 2011

ER -

Compressed sensing based analytical modeling for Through-Silicon-Via pairs

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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Cite this