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Circuit models for 3D structures with incident fields

  • IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original languageEnglish
Title of host publicationIEEE International Symposium on Electromagnetic Compatibility
PublisherPubl by IEEE
Pages28-32
Number of pages5
ISBN (Print)0780313054, 9780780313057
StatePublished - 1993
Externally publishedYes
EventProceedings of the International Symposium on Electromagnetic Compatibility - Dallas, TX, USA
Duration: Aug 9 1993 → Aug 13 1993

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)0190-1494

Conference

ConferenceProceedings of the International Symposium on Electromagnetic Compatibility
CityDallas, TX, USA
Period8/9/93 → 8/13/93

ASJC Scopus Subject Areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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