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Characterizing interfacial sliding of through-silicon-via by nano-indentation

Research output: Contribution to journal › Article › peer-review

Original languageEnglish
Article number7876835
Pages (from-to)355-363
Number of pages9
JournalIEEE Transactions on Device and Materials Reliability
Volume17
Issue number2
DOIs
StatePublished - Jun 2017

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

Keywords

  • Interfacial sliding
  • Nanoindentation
  • Through-silicon via
  • Traction-separation relation

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