@article{c2a3ebeae2ea4032ac92d78834e23471,
title = "Capacitance calculation for via structures using an integral equation method based on partial capacitance",
keywords = "Equation method, image theory, integral shared-antipad, partial capacitance, via-to-plane capacitance",
author = "Hanfeng Wang and Siming Pan and Jingook Kim and Ruehli, \{Albert E.\} and Jun Fan",
year = "2013",
month = dec,
doi = "10.1109/TCPMT.2013.2272323",
language = "English",
volume = "3",
pages = "2134--2146",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
number = "12",
}