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Block-by-block link-path analysis and design with physics-based models

Research output: Contribution to journalConference articlepeer-review

Original languageEnglish
Article number4652245
JournalIEEE International Symposium on Electromagnetic Compatibility
Volume2008-January
DOIs
StatePublished - 2008
Event2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 - Detroit, MI, Germany
Duration: Aug 18 2008Aug 22 2008

ASJC Scopus Subject Areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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