Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultrathin device

Xiaowu Zhang; Ranjan Rajoo; Cheryl S. Selvanayagam; Aditya Kumar; Vempati Srinivasa Rao; Navas Khan; Vaidyanathan Kripesh; John H. Lau; Dim Lee Kwong; Venky Sundaram; Rao R. Tummala

doi:10.1109/TCPMT.2012.2192731

Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultrathin device

Xiaowu Zhang
, Ranjan Rajoo
, Cheryl S. Selvanayagam
, Aditya Kumar
, Vempati Srinivasa Rao
, Navas Khan
, Vaidyanathan Kripesh
, John H. Lau
, Dim Lee Kwong
, Venky Sundaram
, Rao R. Tummala

Agency for Science, Technology and Research, Singapore
Georgia Institute of Technology

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	6189774
Pages (from-to)	935-943
Number of pages	9
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	2
Issue number	6
DOIs	https://doi.org/10.1109/TCPMT.2012.2192731
State	Published - 2012
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Keywords

Drop impact test
Piezoresistive stress sensors
stress measurement
ultrathin device packaging and assembly
wafer bumping and handling

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10.1109/TCPMT.2012.2192731

Cite this

Zhang, X., Rajoo, R., Selvanayagam, C. S., Kumar, A., Rao, V. S., Khan, N., Kripesh, V., Lau, J. H., Kwong, D. L., Sundaram, V., & Tummala, R. R. (2012). Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultrathin device. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(6), 935-943. Article 6189774. https://doi.org/10.1109/TCPMT.2012.2192731

Zhang, X, Rajoo, R, Selvanayagam, CS, Kumar, A, Rao, VS, Khan, N, Kripesh, V, Lau, JH, Kwong, DL, Sundaram, V & Tummala, RR 2012, 'Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultrathin device', IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 6, 6189774, pp. 935-943. https://doi.org/10.1109/TCPMT.2012.2192731

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title = "Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultrathin device",

keywords = "Drop impact test, Piezoresistive stress sensors, stress measurement, ultrathin device packaging and assembly, wafer bumping and handling",

author = "Xiaowu Zhang and Ranjan Rajoo and Selvanayagam, \{Cheryl S.\} and Aditya Kumar and Rao, \{Vempati Srinivasa\} and Navas Khan and Vaidyanathan Kripesh and Lau, \{John H.\} and Kwong, \{Dim Lee\} and Venky Sundaram and Tummala, \{Rao R.\}",

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doi = "10.1109/TCPMT.2012.2192731",

language = "English",

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AU - Zhang, Xiaowu

AU - Rajoo, Ranjan

AU - Selvanayagam, Cheryl S.

AU - Kumar, Aditya

AU - Rao, Vempati Srinivasa

AU - Khan, Navas

AU - Kripesh, Vaidyanathan

AU - Lau, John H.

AU - Kwong, Dim Lee

AU - Sundaram, Venky

AU - Tummala, Rao R.

PY - 2012

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KW - Piezoresistive stress sensors

KW - stress measurement

KW - ultrathin device packaging and assembly

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Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultrathin device

ASJC Scopus Subject Areas

Keywords

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