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Analyzing multiple vias in a parallel-plate pair based on a nonorthogonal PEEC method

  • Xinglin Sun
  • , Tiantian Huang
  • , Lingyun Ye
  • , Yin Sun
  • , Shuai Jin
  • , Jun Fan

Research output: Contribution to journal › Article › peer-review

Original languageEnglish
Article number8477035
Pages (from-to)1602-1611
Number of pages10
JournalIEEE Transactions on Electromagnetic Compatibility
Volume61
Issue number5
DOIs
StatePublished - Oct 2019

ASJC Scopus Subject Areas

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • Complex via structure
  • connect to the plate region
  • improved circuits
  • partial element equivalent circuit (PEEC)
  • rectangular local via structure
  • via modeling
  • virtual interfaces

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