@article{8996d37af4924559b9d14629b38e38d9,
title = "Analytical prediction of crosstalk among vias in multilayer printed circuit boards",
keywords = "Physics-based via circuit model, printed circuit board (PCB), signal integrity, via crosstalk, via models",
author = "Songping Wu and Jun Fan",
year = "2012",
month = apr,
doi = "10.1109/TEMC.2011.2179658",
language = "English",
volume = "54",
pages = "413--420",
journal = "IEEE Transactions on Electromagnetic Compatibility",
issn = "0018-9375",
number = "2",
}