An Impact of Layer Stack-up on EMI

S. Radu; Theodore M. Zeeff; Joe Nuebel; James L. Drewniak; Todd H. Hubing; Thomas Van Doren

doi:10.1109/ISEMC.1998.750314

An Impact of Layer Stack-up on EMI

S. Radu
, Theodore M. Zeeff
, Joe Nuebel
, James L. Drewniak
, Todd H. Hubing
, Thomas Van Doren

Electrical and Computer Engineering

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

Investigation of a server shows the heatsink of the CPU module as a primary component of the EMI coupling path. In order to identify the specific noise source and coupling path to the heatsink, a series of experiments were defined to provide support for one source and eliminate others. Based on experiments with two different versions of the CPU module, a stack-up related design guideline is proposed: a ground layer should be the first entire plane (as opposed to V _cc ) on the active component side of the board. If there are known IC sources that switch significant currents with the outputs unloaded at nanosecond rise and fall times on both sides of the board, then ground should be the first entire plane on both sides of the board when feasible.

Original language	American English
Journal	Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1998, Denver, CO)
Volume	2
DOIs	https://doi.org/10.1109/ISEMC.1998.750314
State	Published - Aug 1 1998

Keywords

CPU Module
EMI
EMI Coupling Path
IC Sources
PCB
Coupling Path
Currents Switching
Electromagnetic Interference
Heat Sinks
Heatsink
Integrated Circuits
Layer Stack-Up
Primary Component
Printed Circuits
Server
Specific Noise Source
Switching

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/ISEMC.1998.750314License: CC BY

An Impact of Layer Stack-up on EMIFinal published version, 600 KBLicense: CC BY

Cite this

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title = "An Impact of Layer Stack-up on EMI",

abstract = " Investigation of a server shows the heatsink of the CPU module as a primary component of the EMI coupling path. In order to identify the specific noise source and coupling path to the heatsink, a series of experiments were defined to provide support for one source and eliminate others. Based on experiments with two different versions of the CPU module, a stack-up related design guideline is proposed: a ground layer should be the first entire plane (as opposed to V cc ) on the active component side of the board. If there are known IC sources that switch significant currents with the outputs unloaded at nanosecond rise and fall times on both sides of the board, then ground should be the first entire plane on both sides of the board when feasible.",

keywords = "CPU Module, EMI, EMI Coupling Path, IC Sources, PCB, Coupling Path, Currents Switching, Electromagnetic Interference, Heat Sinks, Heatsink, Integrated Circuits, Layer Stack-Up, Primary Component, Printed Circuits, Server, Specific Noise Source, Switching",

author = "S. Radu and Zeeff, \{Theodore M.\} and Joe Nuebel and Drewniak, \{James L.\} and Hubing, \{Todd H.\} and \{Van Doren\}, Thomas",

year = "1998",

month = aug,

day = "1",

doi = "10.1109/ISEMC.1998.750314",

language = "American English",

volume = "2",

journal = "Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1998, Denver, CO)",

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AU - Radu, S.

AU - Zeeff, Theodore M.

AU - Nuebel, Joe

AU - Drewniak, James L.

AU - Hubing, Todd H.

AU - Van Doren, Thomas

PY - 1998/8/1

Y1 - 1998/8/1

N2 - Investigation of a server shows the heatsink of the CPU module as a primary component of the EMI coupling path. In order to identify the specific noise source and coupling path to the heatsink, a series of experiments were defined to provide support for one source and eliminate others. Based on experiments with two different versions of the CPU module, a stack-up related design guideline is proposed: a ground layer should be the first entire plane (as opposed to V cc ) on the active component side of the board. If there are known IC sources that switch significant currents with the outputs unloaded at nanosecond rise and fall times on both sides of the board, then ground should be the first entire plane on both sides of the board when feasible.

AB - Investigation of a server shows the heatsink of the CPU module as a primary component of the EMI coupling path. In order to identify the specific noise source and coupling path to the heatsink, a series of experiments were defined to provide support for one source and eliminate others. Based on experiments with two different versions of the CPU module, a stack-up related design guideline is proposed: a ground layer should be the first entire plane (as opposed to V cc ) on the active component side of the board. If there are known IC sources that switch significant currents with the outputs unloaded at nanosecond rise and fall times on both sides of the board, then ground should be the first entire plane on both sides of the board when feasible.

KW - CPU Module

KW - EMI

KW - EMI Coupling Path

KW - IC Sources

KW - PCB

KW - Coupling Path

KW - Currents Switching

KW - Electromagnetic Interference

KW - Heat Sinks

KW - Heatsink

KW - Integrated Circuits

KW - Layer Stack-Up

KW - Primary Component

KW - Printed Circuits

KW - Server

KW - Specific Noise Source

KW - Switching

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/1439

U2 - 10.1109/ISEMC.1998.750314

DO - 10.1109/ISEMC.1998.750314

M3 - Article

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JO - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1998, Denver, CO)

JF - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1998, Denver, CO)

ER -

An Impact of Layer Stack-up on EMI

Abstract

Keywords

Disciplines

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