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Advanced techniques in quartz wafer precision processing: Stealth dicing based on filament-induced laser machining

Research output: Contribution to journal › Article › peer-review

Original languageEnglish
Article number110474
JournalOptics and Laser Technology
Volume171
DOIs
StatePublished - Apr 1 2024

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Keywords

  • Femtosecond laser machining
  • Filament-induced laser machining
  • Quartz crystals
  • Stealth dicing

Disciplines

  • Electrical and Computer Engineering

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