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Accuracy of physics-based via models for simulation of dense via arrays

  • Sebastian Müller
  • , Xiaomin Duan
  • , Miroslav Kotzev
  • , Yao Jiang Zhang
  • , Jun Fan
  • , Xiaoxiong Gu
  • , Young H. Kwark
  • , Renato Rimolo-Donadio
  • , Heinz Dietrich Brüns
  • , Christian Schuster
  • Hamburg University of Technology
  • Missouri University of Science and Technology
  • IBM

Research output: Contribution to journal › Article › peer-review

Original languageEnglish
Article number6193423
Pages (from-to)1125-1136
Number of pages12
JournalIEEE Transactions on Electromagnetic Compatibility
Volume54
Issue number5
DOIs
StatePublished - 2012

ASJC Scopus Subject Areas

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • Mode conversion
  • Parallel plates
  • Physics-based via model
  • Power distribution network
  • Printed circuit board (PCB)
  • Signal integrity

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