A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures

Wei Yang; Qiang Ming Cai; Feng Guo; Yu Tang; Tao Zhou; Xin Cao; Longjian Zhou; Haoran Li; Zhen Yong Du; Yixiang Li; Yuyu Zhu; Bo Pu; Jun Fan

doi:10.1109/PIERS62282.2024.10618761

A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures

Wei Yang
, Qiang Ming Cai
, Feng Guo
, Yu Tang
, Tao Zhou
, Xin Cao
, Longjian Zhou
, Haoran Li
, Zhen Yong Du
, Yixiang Li
, Yuyu Zhu
, Bo Pu
, Jun Fan

Southwest University of Science and Technology
Robot Technology Used for Special Environment Key Laboratory of Sichuan Province
Ltd.
Ltd.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350375909
DOIs	https://doi.org/10.1109/PIERS62282.2024.10618761
State	Published - 2024
Externally published	Yes
Event	2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Chengdu, China Duration: Apr 21 2024 → Apr 25 2024

Publication series

Name	2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings

Conference

Conference	2024 Photonics and Electromagnetics Research Symposium, PIERS 2024
Country/Territory	China
City	Chengdu
Period	4/21/24 → 4/25/24

ASJC Scopus Subject Areas

Computer Networks and Communications
Instrumentation
Atomic and Molecular Physics, and Optics
Radiation

Access to Document

10.1109/PIERS62282.2024.10618761

Cite this

Yang, W., Cai, Q. M., Guo, F., Tang, Y., Zhou, T., Cao, X., Zhou, L., Li, H., Du, Z. Y., Li, Y., Zhu, Y., Pu, B., & Fan, J. (2024). A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures. In 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings (2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PIERS62282.2024.10618761

A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures. / Yang, Wei; Cai, Qiang Ming; Guo, Feng et al.
2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2024. (2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yang, W, Cai, QM, Guo, F, Tang, Y, Zhou, T, Cao, X, Zhou, L, Li, H, Du, ZY, Li, Y, Zhu, Y, Pu, B & Fan, J 2024, A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures. in 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings. 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024, Chengdu, China, 4/21/24. https://doi.org/10.1109/PIERS62282.2024.10618761

Yang W, Cai QM, Guo F, Tang Y, Zhou T, Cao X et al. A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures. In 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2024. (2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings). doi: 10.1109/PIERS62282.2024.10618761

Yang, Wei ; Cai, Qiang Ming ; Guo, Feng et al. / A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures. 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2024. (2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings).

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title = "A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures",

author = "Wei Yang and Cai, \{Qiang Ming\} and Feng Guo and Yu Tang and Tao Zhou and Xin Cao and Longjian Zhou and Haoran Li and Du, \{Zhen Yong\} and Yixiang Li and Yuyu Zhu and Bo Pu and Jun Fan",

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AU - Zhou, Tao

AU - Cao, Xin

AU - Zhou, Longjian

AU - Li, Haoran

AU - Du, Zhen Yong

AU - Li, Yixiang

AU - Zhu, Yuyu

AU - Pu, Bo

AU - Fan, Jun

PY - 2024

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DO - 10.1109/PIERS62282.2024.10618761

M3 - Conference contribution

AN - SCOPUS:85201951137

T3 - 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings

BT - 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2024 Photonics and Electromagnetics Research Symposium, PIERS 2024

Y2 - 21 April 2024 through 25 April 2024

ER -

A VIE-PEEC Method with Prism and Tetrahedron Mesh for Circuit Parameters Extraction from Complex Packaging Structures

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ASJC Scopus Subject Areas

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