@article{e6a8a77fe0504eb89f71f51e6a0a00c2,
title = "A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures",
keywords = "Equivalent thermal conductivity, Joule heating, finite difference method, interconnects, packaging, resistance solver, thermal analysis, three-dimensional integration (3DI), very-large-scale integration (VLSI)",
author = "Lijun Jiang and Chuan Xu and Rubin, \{Barry J.\} and Weger, \{Alan J.\} and Alina Deutsch and Howard Smith and Alain Caron and Kaustav Banerjee",
year = "2010",
month = nov,
doi = "10.1109/TADVP.2010.2090348",
language = "English",
volume = "33",
pages = "777--786",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
number = "4",
}