Research output per year
Research output per year
Personal profile
About
DongHyun (Bill) Kim received B.S., M.S. and Ph.D. degrees in electrical engineering from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea, in 2012, 2014 and 2018, respectively. In 2018, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, and is currently an Assistant Professor with the Missouri S&T EMC Laboratory, Rolla, MO, USA.
His current research interests include nanometer-scale devices, through-silicon via (TSV) technology, dielectric material characterization and signal integrity (SI), power integrity (PI), temperature integrity (TI), electromagnetic compatibility (EMC) and electrostatic discharge (ESD) in 2.5D/3D IC systems.
He is a recipient of IEEE-HKN Outstanding Young Professional Award, IEEE EMC Society Herbert K. Mertel Young Professional award, the IEEE Region 5 Outstanding Young Professional (formerly GOLD) Award, IEEE St. Louis Section Outstanding Young Engineer Award, IEEE APEMC Outstanding Young Scientist Award and DesignCon Best Paper Award. He is a co-recipient of DesignCon Early Career Best Paper Awards and IEEE EMC Symposium Best Paper Awards. He is currently serving as the vice-chair of IEEE EMC Society TC-10 (Signal Integrity and Power Integrity) and the Chair of IEEE St. Louis Section.
Contact Information
119 Emerson Electric Company Hall, Missouri S&T
Rolla, MO 65409
573-341-4262
Related documents
Education/Academic qualification
Ph.D. in Electrical and Computer Engineering, Korea Advanced Institute of Science and Technology (KAIST)
… → 2018
M.S. in Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST)
… → 2014
B.S. in Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST)
… → 2012
External positions
Visiting Researcher, Nanyang Technological University
Jan 1 2016 → Apr 1 2016
Research Interests
- Signal Integrity (SI)
- Power Integrity (PI)’
- Electromagnetic Compatibility (EMC)
- Semiconductor Devices
- Nanometer Scale Devices
- TSV technology
- SI/PI/EMC issues in 2.5D/3D IC systems
Disciplines
- Electrical and Computer Engineering
- Electromagnetics and Photonics
Fingerprint
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Advanced Detection of SARS-CoV-2 and Omicron Variants via MXene-Graphene Hybrid Biosensors Utilizing Nucleic Acid Probes
Li, J., Zhang, Y., Wei, C., Li, Y., Peng, Z., Chuang, H. Y., Pearce, L., Boon, A., Huang, Y. W., Kim, D. H., Wang, R. & Wu, C., Dec 27 2024, In: ACS Applied Nano Materials. 7, 24, p. 28255-28272 18 p.Research output: Contribution to journal › Article › peer-review
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Analytical Modeling of Partially-filled TM010-Mode Dielectric Resonator for Accurate DK and DF Extraction
Mousavi, M., Li, C., Asadi, R., Mousavi, S., Vahdani, R., Ye, X., Esmaeelpour, M. & Kim, D. H., 2024, 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc., p. 130-134 5 p. (IEEE International Symposium on Electromagnetic Compatibility).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Cascading of 2D and 3D Simulations of ASIC Substrate Interconnect up to 100 GHz
Peng, Z., Park, J., Bandi, S., Pappu, S., Venkataraman, S., Wang, X., Ranzaswamy, G. & Kim, D. H., 2024, 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024. Institute of Electrical and Electronics Engineers Inc., (33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Controller Area Network With Flexible Data Rate (CAN FD) Eye Diagram Prediction
Park, J., Lee, M., Park, S., Kim, J., Kim, J. & Kim, D., Jan 1 2024, In: IEEE Transactions on Electromagnetic Compatibility. 66, 3, p. 1-11 11 p.Research output: Contribution to journal › Article › peer-review
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Design of the TM010 mode cylindrical cavity resonator for PCB dielectric characterization
Asadi, R., Li, C., Mousavi, S., Mousavi, S. M., Vahdani, R., Ye, X. & Kim, D. H., 2024, 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc., p. 125-129 5 p. (IEEE International Symposium on Electromagnetic Compatibility).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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IEEE Region 5 St. Louis Section (External organization)
Kim, D. (Member)
Jan 1 2023 → …Activity: Membership › Membership of committee
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IEEE EMC Society Technical Committee 10 - Signal and Power Integrity (External organization)
Kim, D. (Member)
Jan 1 2022 → …Activity: Membership › Membership of committee
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IEEE-Eta Kappa Nu (HKN) (External organization)
Kim, D. (Member)
Jan 1 2019 → …Activity: Membership › Membership of network
Press/Media
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Seoul National University Researchers Provide New Study Findings on Immunology (Characteristics of house dust mite allergens in Southeast and East Asia with the effect of hygienic practices)
12/11/24
1 item of Media coverage
Press/Media: Research
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Data on Volatile Organic Compounds Detailed by Researchers at Seoul National University (Semi-volatile organic compounds and trace metals in air cleaner captured house dust)
12/5/24
1 item of Media coverage
Press/Media: Research