US Patent Issued to SAMSUNG ELECTRONICS on Aug. 8 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

Press/Media: Research

Period	Aug 9 2023

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Aug. 8 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	8/9/23
URL	metabase.moreover.com/noarticleurl?type=psh&lni=68WV-TMW1-JDKC-R2J4-00000-00
Persons	Seung Jong Park